As the electronics industry moves towards more complex semiconductor packages that are smaller, faster and higher performance, engineers are faced with the challenge of trying to fit
more powerful components into a smaller area without causing long term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation.
STATS ChipPAC offers the following characterization services:
• Electrical Analysis
• Thermal Analysis
• Mechanical Analysis
• Mold Flow Analysis
STATS ChipPAC’s worldwide Package Characterization team located in Singapore, South Korea, and the United States (Arizona and California) provide advanced package characterization services for our global customers to ensure they have high quality, high performance, reliable and cost effective package designs that meet their market requirements.