Breakthrough FlexLineTM Manufacturing Approach
Our innovative approach to wafer level manufacturing, known as the FlexLineTM method, provides customers freedom from wafer diameter constraints, while enabling supply chain simplification and significant cost reductions that are not possible with a conventional manufacturing flow. This FlexLine manufacturing method is a significant paradigm shift from conventional wafer level manufacturing, and delivers an unmatched level of flexibility and cost savings for both Fan-In and Fan-Out wafer level packaging.
The FlexLine approach provides freedom from wafer diameter constraints while enabling supply chain simplification and significant cost reductions not possible with conventional wafer level manufacturing.
Versatile technology platform for 2.5D and 3D integration
Increasing demand for more advanced, smaller and lighter mobile products with superior functionality and lower overall cost is driving the need for more innovative and sophisticated packaging technologies. Fan-out wafer level packaging, also known as embedded Wafer Level Ball Grid Array (eWLB), provides a versatile platform for the semiconductor industry’s evolution from single or multi-die 2D packages to 2.5D and 3D ICs or SiP configurations that deliver:
• Higher performance
• Higher frequencies
• Higher bandwidth
• Thinner package profiles